chip (Total 108359 Patents Found)

Chip (108359 Patents Found)
A container that includes a sound assembly mounted thereon. The sound assembly includes a sound chip activated by a light sensor. An opening is cut into the container for receiving the sound chip which is mounted on a mounting member. The mounting member, in turn, is sealed to the container such that the opening is com...
A microprocessor has on-chip hardware for protecting software against unauthorized use. The microprocessor includes a decoder for deciphering software instruction codes prior to their execution by the microprocessor. The instruction codes are enciphered in a unique way so that they can only be executed by the specific ...
A method for fabricating an integrated circuit package or arrangement includes providing a carrier having a surface topography of projections or recesses for supporting individual semiconductor circuit chips having conversely matching bottom surface topographies to permit self-aligned positioning of the chip on the car...
A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wi...
A flat package piezoelectric oscillator, sealed with resin, and having leads or terminals includes an IC chip mounted on one side of an island portion of a lead frame, and a piezoelectric oscillator element mounted on an opposite side of the island portion. The resin package of the oscillator has at least one hole thro...
An IC chip, a board, information processing equipment, and a storage medium are provided that can prevent, even when information is transferred between a plurality of programs, leaking of a right protection algorithm of information in connection with the transfer, by generating an encryption key using a separately prov...
Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior ...
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate i...
The bio chip and the apparatus for analyzing biological material are disclosed, the bio chip and the apparatus being capable of analyzing a variety of specific materials included in biological materials using a single bio chip injected with a single biological material, capable of conducting an optical measurement and ...
Methods, systems, and media for reducing memory latency seen by processors by providing a measure of control over on-chip memory (OCM) management to software applications, implicitly and/or explicitly, via an operating system are contemplated. Many embodiments allow part of the OCM to be managed by software application...
A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is expose...
A semiconductor chip module and forming method is provided. The module includes a support member having at least one well being open to receive a semiconductor chip. Each well depth is substantially equal to the thickness of a chip. The support member has a planar region surrounding each well. A chip is in each well. A...
A light-emitting chip ( 3 ) has a lens-type coupling-out window ( 4 ), whose base area ( 5 ) is provided with a mirror area ( 6 ). Arranged on a coupling-out area ( 7 ) of the coupling-out window ( 4 ) is a layer sequence ( 9 ), with a photon-emitting pn junction ( 10 ). The photons emitted by the pn junction are refle...
A semiconductor chip can include a semiconductor substrate, an input portion and an output portion. A circuit element can be formed in the semiconductor substrate. The input portion can be formed on the semiconductor substrate. The input portion can include a first input pad to receive an input signal from the outside ...
Methods and apparatus of delegating instructions or data from a CU to an NOC node in a network on chip (NOC) is disclosed. The NOC node executes the delegated instructions or processes the delegated data. An NOC controller (NCC), which is operatively coupled to the CU and the NOC node, facilitates delegating the instru...
Semiconductor chips with curable out of specification measured values of an anneal-activated parameter are identified at a test step. A plurality of anneal plans are generated to include at least one of the identified semiconductor chips. A net yield improvement is calculated for each anneal plan. Each anneal plan incl...
Several systems and methods of chip select are described. In one such method, a device maintains two identifiers, (ID_a and ID_m). When the device receives a command, it examines the values of ID_a and ID_m relative to a third reference identifier (ID_s). If either ID_a or ID_m is equivalent to ID_s, the device execute...
A system-on-chip (SoC) may include a master, a slave, and an asynchronous interface having a first first-in first-out (FIFO) memory connected to the master and the slave. A write operation of the FIFO memory is controlled based upon a comparison of a write pointer and an expected write pointer of the FIFO memory, and a...
An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive streng...
Various embodiments are directed to providing constant phase digital attenuation. In one embodiment, a digital attenuator circuit ( 100 ) comprises an input node ( 102 ) to receive an input signal to be attenuated, an output node ( 104 ) to output an attenuated signal, a reference loss path ( 106 ) between the input no...
An edge emitting semiconductor laser chip includes at least one contact strip, wherein the contact strip has a width B, an active zone, in which electromagnetic radiation is generated during the operation of the semiconductor laser chip, and at least two current barriers, arranged on different sides of the contact stri...
The present invention relates to a method for application of a chip module to an antenna module, wherein antenna contact surfaces formed on an application side ( 36 ) of the chip module are contacted with contact surfaces of an antenna disposed on an antenna side of an antenna substrate in an electrically conductive ma...
An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a wiring part and an additional wiring part. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings. The wiring p...
The enumeration of cells in fluids by flow cytometry is widely used across many disciplines such as assessment of leukocyte subsets in different bodily fluids or of bacterial contamination in environmental samples, food products and bodily fluids. For many applications the cost, size and complexity of the instruments p...
An embedded chip package (ECP) includes a plurality of re-distribution layers joined together in a vertical direction to form a lamination stack, each re-distribution layer having vias formed therein. The embedded chip package also includes a first chip embedded in the lamination stack and a second chip attached to the...
A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and ext...
Provided is a biochemical test chip including an insulating substrate, an electrode unit, a first insulating septum, a reactive layer and a second insulating septum. The insulating substrate has a first vent hole. The electrode unit is located on the insulating substrate. The first insulating septum is located on the e...
The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, a...
An ECG sensor chip used in a wearable appliance includes; a switch controlled by a switching signal, an amplifier that amplifies a difference between first and second ECG signals, and a location indicator that generates the switching signal. The switch passes either a first ECG signal or second ECG signal in response t...