Manufacture of pre-coated board



PURPOSE: To remove flux residue of cream solder efficiently by a method wherein, after a solder reflow process, a board is washed with perfluoro organic liquid which is heated to a temperature higher than the melting point of the flux residue before the residue is solidified. CONSTITUTION: A washer 2 employing perfluoro organic liquid is combined with a vapor phase heating furnace 1 employing perfluoro organic liquid. The vapor phase heating furnace 1 has a vapor generator 3 having a perfluoro organic liquid storage tank 4, a conveying means 6 and a nozzle for scattering the perfluoro organic liquid. In a washing section provided by the washer, the perfluoro organic liquid is scattered against a printed wiring board after a reflow process before flux residue is solidified. After cream solder is reflowed, before the flux residue of the cream solder is solidified, the perfluoro organic liquid which is heated to a temperature higher than the melting point of the flux residue is scattered from the nozzle 13 of the washer 2 to wash the board. COPYRIGHT: (C)1993,JPO&Japio
(57)【要約】 【目的】はんだコート後におけるフラックス残渣、はん だボール等の除去を効率よく行うことが可能なプリコー ト基板の製造方法を提供する。 【構成】プリント配線基板のパッド上に塗布されたクリ ームはんだをパーフルオロ有機液体の加熱蒸気中で加熱 し、はんだをリフローした後、該クリームはんだのフラ ックス残渣が固化する前に、フラックス残渣の融点以上 の温度に加熱された液状のパーフルオロ有機液体で該基 板を洗浄する




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    JP-4600672-B2December 15, 2010三菱マテリアル株式会社Au−Sn合金はんだペーストを用いた基板と素子の接合方法
    US-6354481-B1March 12, 2002Speedline Technologies, Inc.Compact reflow and cleaning apparatus
    WO-0134335-A1May 17, 2001Speedline Technologies, Inc.Dispositif compact de soudure par fusion et de nettoyage