Manufacture of pre-coated board

プリコート基板の製造方法

Abstract

PURPOSE: To remove flux residue of cream solder efficiently by a method wherein, after a solder reflow process, a board is washed with perfluoro organic liquid which is heated to a temperature higher than the melting point of the flux residue before the residue is solidified. CONSTITUTION: A washer 2 employing perfluoro organic liquid is combined with a vapor phase heating furnace 1 employing perfluoro organic liquid. The vapor phase heating furnace 1 has a vapor generator 3 having a perfluoro organic liquid storage tank 4, a conveying means 6 and a nozzle for scattering the perfluoro organic liquid. In a washing section provided by the washer, the perfluoro organic liquid is scattered against a printed wiring board after a reflow process before flux residue is solidified. After cream solder is reflowed, before the flux residue of the cream solder is solidified, the perfluoro organic liquid which is heated to a temperature higher than the melting point of the flux residue is scattered from the nozzle 13 of the washer 2 to wash the board. COPYRIGHT: (C)1993,JPO&Japio
(57)【要約】 【目的】はんだコート後におけるフラックス残渣、はん だボール等の除去を効率よく行うことが可能なプリコー ト基板の製造方法を提供する。 【構成】プリント配線基板のパッド上に塗布されたクリ ームはんだをパーフルオロ有機液体の加熱蒸気中で加熱 し、はんだをリフローした後、該クリームはんだのフラ ックス残渣が固化する前に、フラックス残渣の融点以上 の温度に加熱された液状のパーフルオロ有機液体で該基 板を洗浄する

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (7)

    Publication numberPublication dateAssigneeTitle
    JP-H03252500-ANovember 11, 1991Showa Denko KkFlux detergent
    JP-H047398-AJanuary 10, 1992Toyoda Gosei Co LtdElectroviscous fluid
    JP-S5378956-AJuly 12, 1978Nippon Electric CoSoldering method of two elements
    JP-S5730204-AFebruary 18, 1982Tokyo Shibaura Electric CoElectrically insulating cooling medium
    JP-S6031295-AFebruary 18, 1985Nippon Denki Home ElectronicsVapor soldering method and device therefor
    JP-S6415664-UJanuary 26, 1989
    JP-S6490141-AApril 06, 1989Air Prod & ChemPerfluorobutyl derivative compound

NO-Patent Citations (0)

    Title

Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-2007061857-AMarch 15, 2007Mitsubishi Materials Corp, 三菱マテリアル株式会社METHOD OF JOINING SUBSTRATE AND ELEMENT USING Au-Sn ALLOY SOLDER PASTE
    JP-4600672-B2December 15, 2010三菱マテリアル株式会社Au−Sn合金はんだペーストを用いた基板と素子の接合方法
    US-6354481-B1March 12, 2002Speedline Technologies, Inc.Compact reflow and cleaning apparatus
    WO-0134335-A1May 17, 2001Speedline Technologies, Inc.Dispositif compact de soudure par fusion et de nettoyage